Decrease of Nano-hardness at Ultra-low Indentation Depths in Copper Single Crystal
نویسندگان
چکیده
منابع مشابه
Nano-indentation of Copper Thin Films on Silicon Substrates
Indentation methods are finding increasing use in the study of mechanical properties of bulk and thin-film materials over a wide range of size scales (e.g., [1,2]). With the increasing sophistication of instrumented, depth-sensing indentation equipment and of computational methods to model the deformation of materials subjected to indentation, there is growing interest in studying the elastopla...
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ژورنال
عنوان ژورنال: Experimental Mechanics
سال: 2015
ISSN: 0014-4851,1741-2765
DOI: 10.1007/s11340-015-0105-2